300 mm Wafer-Level, Ultra-Dense Arrays of Au-Capped Nanopillars with sub-10 nm Gaps as Reliable SERS Substrates

Nanoscale , 2014, Accepted Manuscript

DOI: 10.1039/C4NR04315D, Communication

Jiaqi Li, Chang Chen, Hilde Jans, Xiumei Xu, Niels Verellen, Ingrid Vos, Yasuaki Okumura, Victor Moshchalkov, Liesbet Lagae, Pol Van Dorpe

The 193 nm deep UV immersion lithography is leveraged to fabricate highly dense and uniform arrays of Au-capped Si nanopillars on a 300 mm wafer level, and the substrates are...

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