Thursday, November 20, 2014

Critical Factors of the 3D Microstructural Formation in Hybrid Conductive Adhesive Materials by X-ray Nano-tomography

Nanoscale , 2014, Accepted Manuscript

DOI: 10.1039/C4NR06068G, Communication

Yu-chen Karen Chen-Wiegart, Miriam Figueroa, Stanislas Petrash, Jose Garcia-Miralles, Jun Wang

Conductive adhesives are found favorable in a wide range of applications including lead-free solder in micro-chip, flexible and printable electronics and enhancing performance for energy storage devices. Composite materials which...

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