Tuesday, March 24, 2015

Robust Ag Nanoplate Pastes for Flexible Electronics Packaging

Nanoscale , 2015, Accepted Manuscript

DOI: 10.1039/C5NR00312A, Paper

Ruo-Zhou Li, Anming Hu, Denzel Bridges, Tong Zhang, Ken D. Oakes, R Peng, Uma Tumuluri, Zili Wu, Zhili Feng

Nanopastes are currently a topic of heightened interest with respect to low temperature bonding processes and printable electronics. We have developed an innovative polyvinylpyrrolidone (PVP)-stabilized Ag nanoplate paste amenable to...

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