The shear response of copper bicrystals with [capital Sigma]11 symmetric and asymmetric tilt grain boundaries by molecular dynamics simulation

Nanoscale , 2015, Advance Article

DOI: 10.1039/C4NR07496C, Paper

Liang Zhang, Cheng Lu, Kiet Tieu, Xing Zhao, Linqing Pei

The dissociated stacking fault from the grain boundary plane can increase ductility while retaining the high strength of the Cu bicrystal model under shear deformation.

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