Nanoscale , 2015, Advance Article
DOI: 10.1039/C5NR00564G, Paper
DOI: 10.1039/C5NR00564G, Paper
Yang Hong, Lei Li, Xiao Cheng Zeng, Jingchao Zhang
By introducing a surface nanoengineering design at sub-nm level, the thermal contact resistance between graphene and copper is reduced by 17% due to enhanced phonon couplings across the interface.
To cite this article before page numbers are assigned, use the DOI form of citation above.
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By introducing a surface nanoengineering design at sub-nm level, the thermal contact resistance between graphene and copper is reduced by 17% due to enhanced phonon couplings across the interface.
To cite this article before page numbers are assigned, use the DOI form of citation above.
The content of this RSS Feed (c) The Royal Society of Chemistry
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