Wednesday, March 18, 2015

Tuning thermal contact conductance at graphene-copper interface via surface nanoengineering




Nanoscale , 2015, Advance Article

DOI: 10.1039/C5NR00564G, Paper

Yang Hong, Lei Li, Xiao Cheng Zeng, Jingchao Zhang

By introducing a surface nanoengineering design at sub-nm level, the thermal contact resistance between graphene and copper is reduced by 17% due to enhanced phonon couplings across the interface.

To cite this article before page numbers are assigned, use the DOI form of citation above.

The content of this RSS Feed (c) The Royal Society of Chemistry





Click for full article

No comments:

Post a Comment