| Nguyen T. M. Hai, Jan Odermatt, Valentine Grimaudo, Karl W. Krämer, Alexander Fluegel, Marco Arnold, Dieter Mayer and Peter Broekmann Link to full article | |||
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Tuesday, March 13, 2012
Potential Oscillations in Galvanostatic Cu Electrodeposition: Antagonistic and Synergistic Effects among SPS, Chloride, and Suppressor Additives
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