Deposition of Copper by Plasma-Enhanced Atomic Layer Deposition Using a Novel N-Heterocyclic Carbene Precursor

Jason P. Coyle, Gangotri Dey, Eric R. Sirianni, Marianna L. Kemell, Glenn P. A. Yap, Mikko Ritala, Markku Leskelä, Simon D. Elliott and Sean T. Barry

Chemistry of Materials

DOI: 10.1021/cm400215q

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