Low-Temperature Atomic Layer Deposition of High Purity, Smooth, Low Resistivity Copper Films by Using Amidinate Precursor and Hydrogen Plasma

Chemistry of Materials

DOI: 10.1021/acs.chemmater.5b02137

Zheng Guo, Hao Li, Qiang Chen, Lijun Sang, Lizhen Yang, Zhongwei Liu and Xinwei Wang
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