Nanoscale Electromechanics To Measure Thermal Conductivity, Expansion, and Interfacial Losses

Nano Letters

DOI: 10.1021/acs.nanolett.5b03451

John P. Mathew, Raj Patel, Abhinandan Borah, Carina B. Maliakkal, T. S. Abhilash and Mandar M. Deshmukh
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