Thursday, April 09, 2015

Robust Ag nanoplate ink for flexible electronics packaging




Nanoscale , 2015, 7,7368-7377

DOI: 10.1039/C5NR00312A, Paper

Ruo-Zhou Li, Anming Hu, Denzel Bridges, Tong Zhang, Ken D. Oakes, Rui Peng, Uma Tumuluri, Zili Wu, Zhili Feng

We develop an innovative bonding using Ag nanoplates via photonic sintering with enhanced mechanical strength and anisotropic resistivity.

The content of this RSS Feed (c) The Royal Society of Chemistry





Click for full article

No comments:

Post a Comment