Wednesday, June 13, 2018

[ASAP] High Thermal Conductivity of Bulk Epoxy Resin by Bottom-Up Parallel-Linking and Strain: A Molecular Dynamics Study

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The Journal of Physical Chemistry C
DOI: 10.1021/acs.jpcc.8b02001


from The Journal of Physical Chemistry C: Latest Articles (ACS Publications) https://ift.tt/2Mpv1Ll
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