Highly Conformal Amorphous W–Si–N Thin Films by Plasma-Enhanced Atomic Layer Deposition as a Diffusion Barrier for Cu Metallization

The Journal of Physical Chemistry C

DOI: 10.1021/jp510226g

Tae Eun Hong, Jae-Hun Jung, Seungmin Yeo, Taehoon Cheon, So Ik Bae, Soo-Hyun Kim, So Jeong Yeo, Hyo-Suk Kim, Taek-Mo Chung, Bo Keun Park, Chang Gyoun Kim and Do-Joong Lee

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