Friday, August 17, 2012

Hierarchical Three-Dimensional Layer-by-Layer Assembly of Carbon Nanotube Wafers for Integrated Nanoelectronic Devices

Takeo Yamada, Natsumi Makiomoto, Atsuko Sekiguchi, Yuki Yamamoto, Kazufumi Kobashi, Yuhei Hayamizu, Yoshiki Yomogida, Hiroyuki Tanaka, Hisashi Shima, Hiroyuki Akinaga, Don N. Futaba and Kenji Hata



TOC Graphic


Nano Letters

DOI: 10.1021/nl3016472






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