Thursday, December 12, 2013

Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics

Nanoscale , 2013, Accepted Manuscript

DOI: 10.1039/C3NR05290G, Paper

Subramaniam Chandramouli, Yuzuri Yasuda, Satoshi Takeya, Seisuke Ata, Ayumi Nishizawa, Don N. Futaba, Takeo Yamada, Kenji Hata

Increasing functional complexity and dimensional compactness of electronic devices have led to progressively higher power dissipation, mainly in the form of heat. Overheating of semiconductor-based electronics has been the primary...

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