Monday, January 20, 2014

Carbon nanotube-copper exhibiting metal-like thermal conductivity and silicon-like thermal expansion for efficient cooling of electronics




Nanoscale , 2014, Advance Article

DOI: 10.1039/C3NR05290G, Paper

Chandramouli Subramaniam, Yuzuri Yasuda, Satoshi Takeya, Seisuke Ata, Ayumi Nishizawa, Don Futaba, Takeo Yamada, Kenji Hata

A composite that synergistically combines the best thermal properties of carbon nanotubes and copper is developed for efficient cooling of microelectronics.

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