Feasibility of atomic layer etching of polymer material based on sequential O2 exposure and Ar low-pressure plasma-etching

Evelina Vogli, Dominik Metzler, and Gottlieb S. Oehrlein

We describe controlled, self-limited etching of a polystyrene polymer using a composite etching cycle consisting of sequential deposition of a thin reactive layer from precursors produced from a polymer-coated electrode within the etching chamber, modification using O2 exposure, and subsequent low ... [Appl. Phys. Lett. 102, 253105 (2013)] published Thu Jun 27, 2013.



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