Friday, January 11, 2013

Interplay between Hydrogen Bonding and Molecule–Substrate Interactions in the Case of Terephthalic Acid Molecules on Cu(001) Surfaces

J. D. Fuhr, A. Carrera, N. Murillo-Quirós, L. J. Cristina, A. Cossaro, A. Verdini, L. Floreano, J. E. Gayone and H. Ascolani



TOC Graphic


The Journal of Physical Chemistry C

DOI: 10.1021/jp305455v






Link to full article
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