Tuesday, March 31, 2015

Robust Ag nanoplate ink for flexible electronics packaging




Nanoscale , 2015, Advance Article

DOI: 10.1039/C5NR00312A, Paper

Ruo-Zhou Li, Anming Hu, Denzel Bridges, Tong Zhang, Ken D. Oakes, Rui Peng, Uma Tumuluri, Zili Wu, Zhili Feng

We develop an innovative bonding using Ag nanoplates via photonic sintering with enhanced mechanical strength and anisotropic resistivity.

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