In this study, the size effect of copper particles on the flash light sintering of copper (Cu) ink was investigated using Cu nanoparticles (20–50 nm diameter) and microparticles (2 μ m diameter). Also, the mixed Cu nano-/micro-inks were fabricated, and the synergetic effects between the Cu nano-ink and micro-ink on flash light sintering were assessed. The ratio of nanoparticles to microparticles in Cu ink and the several flash light irradiation conditions (irradiation energy density, pulse number, on-time, and off-time) were optimized to obtain high conductivity of Cu films. In order to precisely monitor the milliseconds-long flash light sintering process, in situ monitoring of electrical resistance and temperature changes of Cu films was conducted during the flash light irradiation using a real-time Wheatstone bridge electrical circuit, thermocouple-based circuit, and a high-rate data acquisition system. Also, several microscopic and spectroscopic characterization t...
Sung-Jun Joo, Hyun-Jun Hwang and Hak-Sung Kim
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Sung-Jun Joo, Hyun-Jun Hwang and Hak-Sung Kim
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