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Friday, March 29, 2013
Deposition of Copper by Plasma-Enhanced Atomic Layer Deposition Using a Novel N-Heterocyclic Carbene Precursor
Jason P. Coyle, Gangotri Dey, Eric R. Sirianni, Marianna L. Kemell, Glenn P. A. Yap, Mikko Ritala, Markku Leskelä, Simon D. Elliott and Sean T. Barry
Chemistry of Materials
DOI: 10.1021/cm400215q
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