Friday, March 29, 2013

Deposition of Copper by Plasma-Enhanced Atomic Layer Deposition Using a Novel N-Heterocyclic Carbene Precursor

Jason P. Coyle, Gangotri Dey, Eric R. Sirianni, Marianna L. Kemell, Glenn P. A. Yap, Mikko Ritala, Markku Leskelä, Simon D. Elliott and Sean T. Barry



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Chemistry of Materials

DOI: 10.1021/cm400215q






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