Zhenxing Li, Masahiko Yoshino and Akinori Yamanaka
A new fabrication method for three-dimensional nanodot arrays with low cost and high throughput is developed in this paper. In this process, firstly a 2D nanodot array is fabricated by combination of top-down and bottom-up approaches. A nanoplastic forming technique is utilized as the top-down approach to fabricate a groove grid pattern on an Au layer deposited on a substrate, and self-organization by thermal dewetting is employed as the bottom-up approach. On the first-layer nanodot array, SiO 2 is deposited as a spacer layer. Au is then deposited on the spacer layer and thermal dewetting is conducted to fabricate a second-layer nanodot array. The effective parameters influencing dot formation on the second layer, including Au layer thickness and SiO 2 layer thickness, are studied. It is demonstrated that a 3D nanodot array of good vertical alignment is obtained by repeating the SiO 2 deposition, Au deposition and thermal dewetting. The mechanism o...
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A new fabrication method for three-dimensional nanodot arrays with low cost and high throughput is developed in this paper. In this process, firstly a 2D nanodot array is fabricated by combination of top-down and bottom-up approaches. A nanoplastic forming technique is utilized as the top-down approach to fabricate a groove grid pattern on an Au layer deposited on a substrate, and self-organization by thermal dewetting is employed as the bottom-up approach. On the first-layer nanodot array, SiO 2 is deposited as a spacer layer. Au is then deposited on the spacer layer and thermal dewetting is conducted to fabricate a second-layer nanodot array. The effective parameters influencing dot formation on the second layer, including Au layer thickness and SiO 2 layer thickness, are studied. It is demonstrated that a 3D nanodot array of good vertical alignment is obtained by repeating the SiO 2 deposition, Au deposition and thermal dewetting. The mechanism o...
Link to full article
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