Inhwa Lee, Sanghyeok Kim, Jeonghoon Yun, Inkyu Park and Taek-Soo Kim
Reliable integration of solution processed nanoparticle thin films for next generation low-cost flexible electronics is limited by mechanical damage in the form of delamination and cracking of the films, which has not been investigated quantitatively or systematically. Here, we directly measured the interfacial fracture energy of silver nanoparticle thin films by using double cantilever beam fracture mechanics testing. It was demonstrated that the thermal annealing temperature and period affect the interfacial fracture energy. Also it was found that the interfacial fracture resistance can be maximized with optimized annealing conditions by the formation of organic residual bridges during the annealing process.
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Reliable integration of solution processed nanoparticle thin films for next generation low-cost flexible electronics is limited by mechanical damage in the form of delamination and cracking of the films, which has not been investigated quantitatively or systematically. Here, we directly measured the interfacial fracture energy of silver nanoparticle thin films by using double cantilever beam fracture mechanics testing. It was demonstrated that the thermal annealing temperature and period affect the interfacial fracture energy. Also it was found that the interfacial fracture resistance can be maximized with optimized annealing conditions by the formation of organic residual bridges during the annealing process.
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