Friday, March 01, 2013

Effects of multi-layer graphene capping on Cu interconnects

Chang Goo Kang, Sung Kwan Lim, Sangchul Lee, Sang Kyung Lee, Chunhum Cho, Young Gon Lee, Hyeon Jun Hwang, Younghun Kim, Ho Jun Choi, Sun Hee Choe, Moon-Ho Ham and Byoung Hun Lee



The benefits of multi-layer graphene (MLG) capping on Cu interconnects have been experimentally demonstrated. The resistance of MLG capped Cu wires improved by 2–7% compared to Cu wires. The breakdown current density increased by 18%, suggesting that the MLG can act as an excellent capping material for Cu interconnects, improving the reliability characteristics. With a proper process optimization, MLG capped Cu interconnects could become a promising technology for high density back end-of-line interconnects.



Link to full article

No comments:

Post a Comment